{"id":659,"date":"2023-05-16T11:17:32","date_gmt":"2023-05-16T02:17:32","guid":{"rendered":"https:\/\/www.murakami.co.jp\/english\/?page_id=659"},"modified":"2023-11-20T11:08:35","modified_gmt":"2023-11-20T02:08:35","slug":"option","status":"publish","type":"page","link":"https:\/\/www.murakami.co.jp\/english\/products\/screen-mask\/option\/","title":{"rendered":"List Of Screen Stencil Options"},"content":{"rendered":"\n
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Graded Boring \/ Stepped Layer Forming<\/h4>\n
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Bleeding inhibition<\/div>
Scratching inhibition<\/div> <\/div>\n

Partially changing the thickness of a photo emulsion on the printing surface of a screen stencil (the surface contacting the printed product) makes printing which had previously been difficult possible.<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

Special Processing – Water and Acid\/Alkaline Resistance<\/h4>\n
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Durability<\/div>
Solvent resistance<\/div> <\/div>\n

This improves the water resistance of photo emulsion and capillary films. Additionally, resistance to acidic and alkaline inks and pastes is imparted.<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

FT-SR\/FT-SRP<\/h4>\n
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Bleeding inhibition<\/div>
Solvent resistance<\/div> <\/div>\n

Processing which imparts liquid repellency to photo emulsions and capillary films, and mesh. Inhibits bleeding (bleedthrough) of inks\/pastes during printing.
\r\nLiquid repellency is maintained over a long period, even with repeated printing and\/or stencil cleaning.<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

FT Processing<\/h4>\n
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Bleeding inhibition<\/div> <\/div>\n

Processing which imparts liquid repellency to photo emulsions and capillary films, and mesh. Inhibits bleeding (bleedthrough) of inks\/pastes during printing.<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

T Processing\/TU Processing<\/h4>\n
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Scratching inhibition<\/div> <\/div>\n

Due to leveraging evenness in thickness and linearity, being benefits of the direct-indirect method, and creating irregularities on smooth surfaces to a degree, scratching which appears due to excessive adherence to the base material during printing is inhibited.
\r\n(Option only for capillary films)<\/p> <\/div>\n

\n \"\"\n <\/div>\n <\/div>\n\n \n \n

T-flat Processing<\/h4>\n
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Bleeding inhibition<\/div> <\/div>\n

T-flat processing improves surface smoothness to the furthest extent possible. With a finish similar to that of a mirror surface, inhibits bleeding of inks\/pastes during printing.<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

Flat Processing<\/h4>\n
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Bleeding inhibition<\/div> <\/div>\n

Flat processing inhibits ink\/paste bleeding during printing of a screen stencil in which emulsion thickness is thin.
\r\n(Option only for emulsions (liquid type))<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

Bleed Inhibiting Photo Emulsion<\/h4>\n
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Bleeding inhibition<\/div> <\/div>\n

Inhibits ink\/paste bleeding (bleedthrough) during printing, facilitating screen stencil cleaning. Further, there are also types in which the photo emulsion itself has liquid repellency, whereby the liquid repellency effect can be maintained.
\r\n(Can only be selected as an option for screen stencils)<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

Next Generation Ultra-High Resolution Photo Emulsion<\/h4>\n
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Abrasion resistance<\/div>
Resolution<\/div>
Solvent resistance<\/div> <\/div>\n

Photo emulsion which further improves upon the resolution of existing ultra-high resolution photo emulsion.
\r\nFine lines as low as 15 \u00b5m can be mass-produced.
\r\n(Can only be selected as an option for screen stencils)<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

Ultra-High Resolution Photo Emulsion<\/h4>\n
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Abrasion resistance<\/div>
Resolution<\/div>
Solvent resistance<\/div> <\/div>\n

Special photo emulsion achieving both ultra-high resolution and high solvent resistance; optimally suited for printing of fine lines.
\r\n(Can only be selected as an option for screen stencils)<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

Polar Solvent Resistant Photo Emulsion<\/h4>\n
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Abrasion resistance<\/div>
Solvent resistance<\/div> <\/div>\n

A dedicated emulsion with resistance to polar solvents such as NMP (N-methyl-pyrrolidone) and alcohols.
\r\n(Can only be selected as an option for screen stencils)<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

High-Resolution Capillary Films<\/h4>\n
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Abrasion resistance<\/div>
Resolution<\/div>
Solvent resistance<\/div> <\/div>\n

A capillary film with high resolution, used only for screens made in our facility.
\r\n(Can only be selected as an option for screen stencils)<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

High-Resolution Emulsion<\/h4>\n
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Abrasion resistance<\/div>
Resolution<\/div>
Solvent resistance<\/div> <\/div>\n

An emulsion with high resolution, used only for screens made in our facility.
\r\n(Can only be selected as an option for screen stencils)
\r\n<\/p> <\/div>\n <\/div>\n\n \n \n

Roller Treatment<\/h4>\n
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Positional precision<\/div> <\/div>\n

By releasing residual stress due to the pseudo-printing load, great dimensional variation occurring at the initial stage of printing is inhibited. Positional precision is improved.
\r\n*Pseudo-printing: Since treatment is performed with a rigid urethane roller, there is no damage.<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

Strengthening of Outer Peripheral Portion<\/h4>\n
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Positional precision<\/div> <\/div>\n

By reinforcing the outer peripheral portion (polyester mesh portion) of a combination screen stencil with metallic foil to increase rigidity, positional precision of the screen stencil can be improved and changes over time during printing can be inhibited.
\r\nThis is effective in inhibiting dimensional variation in the early stages of printing and dimensional variation due to stress during printing.<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

Blasting<\/h4>\n
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Durability<\/div>
Permeability<\/div>
Resolution<\/div> <\/div>\n

Conducting blasting on mesh, being the supporting body of photo emulsion, makes it possible to expect improvement in resolution of screen making due to inhibition of halation during exposure, improvement in adhesiveness, and improvement in paste permeability due to improvement in paste wettability.<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

Combination<\/h4>\n
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Durability<\/div>
Positional precision<\/div> <\/div>\n

Compared to screens where stainless steel mesh is only used, printability is improved and deviation during printing is inhibited. Decrease in cost due to using less stainless steel mesh (expensive).<\/p> <\/div>\n

\n \"\"\n <\/div>\n <\/div>\n\n \n \n

Metal Plating<\/h4>\n
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Durability<\/div>
Positional precision<\/div> <\/div>\n

By covering mesh with nickel plating to intersections, warping during printing is inhibited. Due to the maintenance\/improvement of positional precision in printing, an increase in the number of printing shots and improvement in durability can be expected.<\/p> <\/div>\n

\n \"\"\n <\/div>\n <\/div>\n\n \n \n

Calendering<\/h4>\n
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Positional precision<\/div>
Resolution<\/div>
Thin film specifications<\/div> <\/div>\n

Using a rolling apparatus, mesh thickness can be specified to units of 1 um. (Some limitations apply) By increasing treatment strength, the mesh becomes resistant to stretching, whereby positional precision in printing improves.
\r\n*By adding blasting, paste permeability toward the back side of the mesh intersection also improves.<\/p> <\/div>\n

\n \"\"\n <\/div>\n <\/div>\n\n \n \n

3D Mesh<\/h4>\n
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Permeability<\/div>
Positional precision<\/div>
Thick film specifications<\/div> <\/div>\n

3D mesh has a unique structure in which only one side of the threads are bent and treated, resulting in a mesh thickness is approximately three times that of the wire diameter.
\r\nMesh intersections contacting with the product surface decreases, contributing to better leveling and evenness of printed film thickness.
\r\n<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

Black Mesh<\/h4>\n
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Positional precision<\/div>
Resolution<\/div> <\/div>\n

By performing this process on the surface of stainless steel, diffused reflections during exposure are prevented, and emulsion wall surfaces are clearly resolved.
\r\n*Further, the effects are improved by performing this together with blasting.
\r\n<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n \n

Tungsten Mesh<\/h4>\n
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Permeability<\/div>
Positional precision<\/div> <\/div>\n

This mesh uses tungsten as its material.
\r\nIt is more resistant to stretching than stainless steel mesh, having high strength.<\/p> <\/div>\n <\/div>\n\n \n \n

High-Strength Stainless Steel Mesh<\/h4>\n
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Permeability<\/div>
Positional precision<\/div> <\/div>\n

Compared to standard products, it uses materials having three times the strength, as well as low elongation. A mesh is made having a high opening percentage of 60%, which also increases the paste deposit amount.<\/p> <\/div>\n

\n \"\"\n \"\" <\/div>\n <\/div>\n\n \n
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\n Customization presets for screen stencils<\/a>\n Explanation of screen stencil by element<\/a>\n <\/div>\n\n <\/div>\n\n
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Narrow down options<\/div>\n
Please select an attribute.
(Multiple choices can be selected)<\/div>\n
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